Water balance optimization in hybrid microfluidic cooler embedded in Silicon interposer for data center application

Abstract

Direct liquid cooling module in thin form factor, or cold plate, greatly improves the capacity and efficiency for high thermal designed power (TDP) processors in modern data centers. To meet the overall cooling demand, previous generation micro-scaled channels, fins, jets and many more fine-structures has been developed. The current generation liquid-cooled cold plates are pursuing better cooling distribution both spatially and temporally, e.g. issues of uniformity, hot-spot and dynamic cooling. While most of the approaches focus on steady-state spatial flow distribution, dynamic adjustable approaches that provide ultimate flexibility of cooling fluid distribution are rare. In the present study, an active flow distribution control algorithm based on piezoelectric micro-valve embedded in a manifold of jet impingement micro-fluidic cooling package will be introduced for non-uniform and dynamic thermal management, especially for integrated 2.5D/3D IC package in data centers for high-performance computing and big-data applications. This study targets on managing and balance of the coolant mass flow distribution across branches of the manifold, to prevent local over-heat in maximum coolant and energy efficiency. Novelties include: 1) a method of active fluid management and balance in micro-channel liquid cooling systems; 2) a directed graph structure for modelling and simulating electronics liquid cooling systems; 3) a controller for the advanced liquid cooling system in data centers.