Numerical investigation on heat transfer enhancement inside a rectangular microchannel with vortex generator using TiO2, Cuo-water nanofluids

Q3 Engineering

Journal of Mechanical Engineering Research and Developments Pub Date : 2020-04-05 DOI:10.30564/jmer.v3i1.1568

Arash Behaeen, M. Nimafar

{"title":"Numerical investigation on heat transfer enhancement inside a rectangular microchannel with vortex generator using TiO2, Cuo-water nanofluids","authors":"Arash Behaeen, M. Nimafar","doi":"10.30564/jmer.v3i1.1568","DOIUrl":null,"url":null,"abstract":"Article history Received: 16 December 2019 Accepted: 17 January 2020 Published Online: 31 March 2020 One of the innovative ways to improve heat transfer properties of heat exchangers, is using nanofluids instead of traditional fluids. Due to presence of metal and oxides of metal particles in nanofluids structure, they have better potential in different environments and conditions than conventional fluids and having higher thermal conductivity causes improvements in heat transfer properties. In this research flow of two different nanofluids through a rectangular microchannel containing a different number of longitudinal vortex generators (lvgs), has been investigated. Simulations conducted under laminar flow boundary condition and for varied Reynolds numbers of 100 to 250. Considered volumetric concentration in this paper is 1, 1/6 and 2/3 %. Results showed, nanofluids and the LVGs notably improve the heat transfer rates within the microchannel. havg improved with increasing the nanoparticles volume concentrations and Reynolds number, while the opposite trends recognized for pressure drop. havg improved for 4 to 12 and 9 to 18% for TiO2 and CuO nanofluids, respectively for different volume concentrations in simple microchannel. For lvg-enhanced microchannel the amount of improvements is about 9-14 and 5-10% for CuO and TiO2, respectively. Also using vortex generators alone improved havg for 15-25% for different number of lvgs.","PeriodicalId":16153,"journal":{"name":"Journal of Mechanical Engineering Research and Developments","volume":"19 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2020-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Mechanical Engineering Research and Developments","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.30564/jmer.v3i1.1568","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}

引用次数: 1

Abstract

Article history Received: 16 December 2019 Accepted: 17 January 2020 Published Online: 31 March 2020 One of the innovative ways to improve heat transfer properties of heat exchangers, is using nanofluids instead of traditional fluids. Due to presence of metal and oxides of metal particles in nanofluids structure, they have better potential in different environments and conditions than conventional fluids and having higher thermal conductivity causes improvements in heat transfer properties. In this research flow of two different nanofluids through a rectangular microchannel containing a different number of longitudinal vortex generators (lvgs), has been investigated. Simulations conducted under laminar flow boundary condition and for varied Reynolds numbers of 100 to 250. Considered volumetric concentration in this paper is 1, 1/6 and 2/3 %. Results showed, nanofluids and the LVGs notably improve the heat transfer rates within the microchannel. havg improved with increasing the nanoparticles volume concentrations and Reynolds number, while the opposite trends recognized for pressure drop. havg improved for 4 to 12 and 9 to 18% for TiO2 and CuO nanofluids, respectively for different volume concentrations in simple microchannel. For lvg-enhanced microchannel the amount of improvements is about 9-14 and 5-10% for CuO and TiO2, respectively. Also using vortex generators alone improved havg for 15-25% for different number of lvgs.

查看原文本刊更多论文

利用TiO2、cuo -水纳米流体对带涡发生器的矩形微通道内强化传热的数值研究

文章历史收稿日期:2019年12月16日接收日期:2020年1月17日在线发布日期:2020年3月31日2020年3月31日使用纳米流体代替传统流体是改善换热器传热性能的创新方法之一。由于纳米流体结构中存在金属和金属颗粒的氧化物，它们在不同的环境和条件下比传统流体具有更好的潜力，并且具有更高的导热性，从而改善了传热性能。本文研究了两种不同的纳米流体在含有不同数量纵向涡发生器(lvgs)的矩形微通道中的流动。在层流边界条件下，在100 ~ 250雷诺数范围内进行了数值模拟。本文考虑的体积浓度分别为1%、1/6和2/3 %。结果表明，纳米流体和LVGs显著提高了微通道内的换热率。随着纳米颗粒体积浓度和雷诺数的增加而改善，而压降则相反。对于简单微通道中不同体积浓度的TiO2和CuO纳米流体，分别提高了4 ~ 12%和9 ~ 18%。对于lvg增强微通道，CuO和TiO2的改善量分别为9- 14%和5-10%。此外，单独使用涡发生器可以提高15-25%的不同数量的lvgs。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Journal of Mechanical Engineering Research and Developments Engineering-Computational Mechanics

自引率

0.00%

发文量

审稿时长

9 weeks

期刊介绍： The scopes of the journal include, but are not limited to, the following topics: • Thermal Engineering and Fluids Engineering • Mechanics • Kinematics, Dynamics, & Control of Mechanical Systems • Mechatronics, Robotics and Automation • Design, Manufacturing, & Product Development • Human and Machine Haptics Specific topics of interest include: Advanced Manufacturing Technology, Analysis and Decision of Industry & Manufacturing System, Applied Mechanics, Biomechanics, CAD/CAM Integration Technology, Complex Curve Design, Manufacturing & Application, Computational Mechanics, Computer-aided Geometric Design & Simulation, Fluid Dynamics, Fluid Mechanics, General mechanics, Geomechanics, Industrial Application of CAD, Machinery and Machine Design, Machine Vision and Learning, Material Science and Processing, Mechanical Power Engineering, Mechatronics and Robotics, Artificial Intelligence, PC Guided Design and Manufacture, Precision Manufacturing & Measurement, Precision Mechanics, Production Technology, Quality & Reliability Engineering, Renewable Energy Technologies, Science and Engineering Computing, Solid Mechanics, Structural Dynamics, System Dynamics and Simulation, Systems Science and Systems Engineering, Vehicle Dynamic Performance Simulation, Virtual-tech Based System & Process-simulation, etc.