Flexible system for real-time plasma decapsulation of copper wire bonded IC packages

J. Tang, J. Schelen, C. Beenakker
{"title":"Flexible system for real-time plasma decapsulation of copper wire bonded IC packages","authors":"J. Tang, J. Schelen, C. Beenakker","doi":"10.1109/ECTC.2012.6249076","DOIUrl":null,"url":null,"abstract":"Improvements of the Microwave Induced Plasma system especially designed for decapsulation of copper wire bonded integrated circuit (IC) packages are described. The system integrates a programmable XYZ-stage and a Charge-Coupled Device (CCD) camera allowing computer controlled process and real-time imaging on the details of the IC package during plasma etching. Parameters that affect the etching profile are investigated. Decapsulation of a plastic small outline package SO32 with 38 um copper wire bonds is conducted by three consecutive etching cycles using plasma beam scanning. The scan route and speed in relation to the plasma recipe and the package structure are discussed in detail. Causes of potential damage on the die and the wire bonds due to plasma etching are explained. Measures to improve the etching uniformity and to avoid potential overetching and oxidization damage are addressed.","PeriodicalId":6384,"journal":{"name":"2012 IEEE 62nd Electronic Components and Technology Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 62nd Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2012.6249076","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

Improvements of the Microwave Induced Plasma system especially designed for decapsulation of copper wire bonded integrated circuit (IC) packages are described. The system integrates a programmable XYZ-stage and a Charge-Coupled Device (CCD) camera allowing computer controlled process and real-time imaging on the details of the IC package during plasma etching. Parameters that affect the etching profile are investigated. Decapsulation of a plastic small outline package SO32 with 38 um copper wire bonds is conducted by three consecutive etching cycles using plasma beam scanning. The scan route and speed in relation to the plasma recipe and the package structure are discussed in detail. Causes of potential damage on the die and the wire bonds due to plasma etching are explained. Measures to improve the etching uniformity and to avoid potential overetching and oxidization damage are addressed.
用于铜线键合IC封装的实时等离子解封装的灵活系统
介绍了专门用于铜线键合集成电路(IC)封装解封装的微波诱导等离子体系统的改进。该系统集成了一个可编程的xyz平台和一个电荷耦合器件(CCD)相机,允许计算机控制过程和在等离子蚀刻过程中对IC封装细节进行实时成像。研究了影响刻蚀轮廓的参数。利用等离子束扫描,通过三个连续的蚀刻周期,对具有38 um铜线键的塑料小轮廓封装SO32进行了脱封。详细讨论了扫描路径和速度与等离子体配方和封装结构的关系。解释了等离子蚀刻对模具和焊丝键的潜在损害的原因。提出了提高蚀刻均匀性、避免过度蚀刻和氧化损伤的措施。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信