Board Level Solder Joint Reliability Design and Analysis of FOWLP

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Pub Date : 2020-12-02 DOI:10.1109/EPTC50525.2020.9314996

Xiaowu Zhang, B. L. Lau, Haoran Chen, Yong Han, M. C. Jong, S. Lim, S. Lim, Xiaobai Wang, Y. Andriani, Songlin Liu

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引用次数: 1

Abstract

This paper presents a comprehensive board level solder joint reliability study under thermal cycling (TC) loading by both numerical simulation and experimental test. TC profile is from −40°C to 125°C. In numerical simulation, both epoxy molding compound (EMC) and dielectric are modeled as viscoelastic materials. SAC is modeled as a creep material while the remaining materials are assumed to be elastic. The critical solder joint location predicted by modeling agrees well with the experimental result. Results show: (1) lower CTE PCB improves the board level solder joint fatigue life as creep strain energy density range of solder joint is reduced when PCB CTE is reduced from 17 ppm/°C to 10ppm/°C; (2) thinned PCB thickness improves the board level solder joint fatigue life as creep strain energy density range of solder joint is reduced when PCB thickness is reduced from 1.5 mm to 1 mm. Finally, life prediction model for solder joints of FOWLP has been successfully established as well.

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FOWLP板级焊点可靠性设计与分析

本文采用数值模拟和实验两种方法对热循环载荷作用下板级焊点的可靠性进行了全面研究。TC轮廓从- 40°C到125°C。在数值模拟中，将环氧成型复合材料(EMC)和介电材料都建模为粘弹性材料。SAC被建模为蠕变材料，而其余材料被假设为弹性材料。模型预测的临界焊点位置与实验结果吻合较好。结果表明:(1)当PCB CTE从17 ppm/°C降低到10ppm/°C时，降低了焊点蠕变应变能密度范围，提高了板级焊点疲劳寿命;(2)当PCB厚度从1.5 mm减小到1 mm时，降低了焊点的蠕变应变能密度范围，提高了板级焊点的疲劳寿命。最后，成功建立了FOWLP焊点寿命预测模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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