Reliability test and IMC investigation of lead and lead free solder joints on different surface finish processes

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382266

Y. Ho, J. Luo, Keven Hsu, Arthur Chen

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引用次数: 1

Abstract

In this study, lead free (Sn-4Ag-0.5Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on various surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) was investigated by its interface morphology and its physical properties. To evaluate the mechanical and physical properties of BGA pad with lead and lead free solder joint, it was tested by bonding strength measuring, shear force test and interfacial microstructure. The IMC (Inter metallic compound) of SAC and SP solder with these finishes were also studied by using Focused Ion Beam (FIB) microscope to observe the crystal grain, morphology and size. It was found that the IMC crystal lattice is dependent on solder material and the solder joint reliability is dependent on both the solder material as well as the surface finish. Moreover, the shear test results show that the shear strength of solder joints could not be significantly influenced by the thickness and morphology of the interfacial IMC.

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不同表面处理工艺下铅焊点和无铅焊点的可靠性试验和IMC研究

研究了无铅(Sn-4Ag-0.5Cu (SAC))和含铅(62Sn-36Pb-2Ag (SP))焊点在浸锡(ImSn)、有机可焊性保护剂(OSPs)、Ni-P/Pd/Au (ENEPIG)和Ni-P/Au (ENIG)等不同表面处理的球栅阵列(BGA)焊盘上的界面形貌和物理性能。为了评价含铅和无铅焊点的BGA焊盘的力学和物理性能，通过结合强度测试、剪切力测试和界面显微组织测试对其进行了测试。利用聚焦离子束(FIB)显微镜对SAC和SP焊料的金属间化合物(IMC)进行了研究，观察了其晶粒、形貌和尺寸。研究发现，IMC晶格与焊料材料有关，而焊点的可靠性既与焊料材料有关，也与表面光滑度有关。剪切试验结果表明，界面IMC的厚度和形貌对焊点的剪切强度影响不显著。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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