Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/Handling

Rich Rochford, Craig Blanchette
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Abstract

High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that can occur during packaging, shipping, and customer handling. This defect condition is especially problematic for automated assembly which strives to be touch-free and efficient with orderly device presentation. COOP is a major contributor to “Cost Of Poor Quality” (COPQ) within the business. A funded study into COOP conditions was conducted and a dozen root causes were identified. It was discovered that traditional “waffle packs” have mechanical issues related to flatness tolerances with respect to the waffle tray and lid. The addition of a standard clip further contributes to the issue, both of which are key root causes of the costly “Component Out Of Pocket” (COOP) condition. A novel Lid-Clip System (LCS2) was engineered to compensate for those mechanical issues, bringing robust captivation and preservation of devices in waffle tray pockets. Static dissipative material for lid and clip was selected to provide unparalleled ESD Class 000 protection for high value devices with the lowest voltage susceptibility thresholds.
消除微电子元件封装/运输/处理过程中昂贵元件的“口袋外”缺陷
用于微波模块和其他微电子组件的高价值器件变得越来越薄,并且容易在包装,运输和客户处理过程中发生“组件自付”(COOP)情况。这种缺陷条件对于自动化装配来说尤其成问题,因为自动化装配力求实现无触摸和高效,并且设备呈现有序。COOP是企业中“低质量成本”(COPQ)的主要贡献者。一项针对COOP情况的资助研究进行了,并确定了十几个根本原因。人们发现,传统的“华夫饼包装”存在与华夫饼托盘和盖子的平面公差有关的机械问题。标准夹的添加进一步加剧了这一问题,这两者都是导致成本高昂的“组件自付”(COOP)状况的关键根源。一种新颖的盖夹系统(LCS2)被设计用来弥补这些机械问题,在华夫饼托盘口袋中带来强大的吸引和保存设备。选择用于盖子和夹子的静电耗散材料,为具有最低电压敏感性阈值的高值设备提供无与伦比的ESD 000级保护。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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