An FDD-based Full-Duplex Sub-THz Interconnect with Data-rate of 22.6 Gb/s and Energy-Efficiency of 1.58pJ/bit

Abstract

A full-duplex sub-THz interconnect based on Frequency Division Duplex (FDD) scheme is proposed for high data-rate and bandwidth-density chip-to-chip communications. The system consists of a dual-band transmitter (TX), receiver (RX), and Si dielectric waveguide (DWG) channel that provides low in-band insertion loss (IL) and high isolation in the two adjacent frequency bands. A full-duplex measurement was set up with Pseudo Random Binary Sequence (PRBS) length of 231-1. With the Bit Error Rates (BER) < 1×10−12, Channel 1 at 140 GHz and Channel 2 at 180 GHz achieve simultaneous On-Off Keying (OOK) modulated data rates of 12.3 Gb/s and 10.3 Gb/s, respectively. This full duplex interconnect system achieves the energy efficiency of 1.58 pJ/b and the record bandwidth density of 150.7 Gb/s/mm2.