Electronic structure of Cu2ZnSn(SxSe1−x)4 surface and CdS/Cu2ZnSn(SxSe1−x)4 interface

Yusuke Udaka, Shin’ichi Takaki, Keisuke Isowaki, T. Nagai, K. Kim, Shinho Kim, H. Tampo, H. Shibata, K. Matsubara, S. Niki, N. Sakai, T. Kato, H. Sugimoto, N. Terada
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引用次数: 7

Abstract

Changes of the electronic structure of the Cu2ZnSn(SxSe1−x)4 [CZTSSe] films and the band alignment at the interfaces between CdS buffer and the CZTSSe in conjunction with the anion-mixing ratio x = 0–1 have been investigated using in situ X-ray, ultraviolet photoemission spectroscopy (XPS, UPS), and inverse photoemission spectroscopy (IPES). Changes of the UPS and IPES spectra in conjunction with x have revealed that the electronic structure of the CZTSSe surface is characterized with the preferential rise of conduction band minimum (CBM) in conjunction with the increase of x. As x increases, interface induced band bending decreases from 0.5 to 0.6 at the CdS/CZTSe (x = 0) interface to 0.1–0.2 at the CdS/CZTS (x = 1) one. And the downward shift of CBM due to the deposition of the CdS layer is enhanced as x increases. These changes result in the monotonous decrease of conduction band offset (CBO) in conjunction with the increase of x: CBO at the x = 0 and 1 interfaces are +0.5 and −0.14 to −0.15 eV, respectively. The values of CBO are consistent with the device properties; occasional emergence of double junction like current–voltage characteristics in the CdS/CZTSe-based cells, serious voltage-loss in the CdS/CZTS ones, and the highest performance achieved in the CdS/CZTSSe ones.
Cu2ZnSn(SxSe1−x)4表面和CdS/Cu2ZnSn(SxSe1−x)4界面的电子结构
利用原位x射线、紫外光导光谱(XPS, UPS)和逆光导光谱(IPES)研究了Cu2ZnSn(SxSe1−x)4 [CZTSSe]薄膜电子结构的变化以及CdS缓冲层与CZTSSe界面处的能带对准,并结合阴离子混合比x = 0-1进行了研究。UPS和IPES光谱随x的变化表明,随着x的增加,CZTSSe表面的电子结构具有导带最小值(CBM)优先上升的特征。随着x的增加,cd /CZTSe (x = 0)界面诱导带弯曲从0.5 ~ 0.6减小到cd /CZTS (x = 1)界面诱导带弯曲的0.1 ~ 0.2。随着x的增大,cd层沉积引起的CBM的下移增强。这些变化导致导带偏置(CBO)单调下降,同时x = 0和1界面的CBO增加,分别为+0.5和- 0.14至- 0.15 eV。CBO值与设备属性一致;基于CdS/CZTS的电池偶尔会出现电流-电压双结特性,CdS/CZTS电池的电压损失严重,而CdS/CZTSSe电池的性能最高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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