Growth and characterization of Ni3FeN thin films by reactive gas timing RF magnetron sputtering

W. Techitdheera, C. Thassana, W. Pecharapa, J. Nukaew
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Abstract

Ni3FeN films were deposited on the glass substrate at room temperature by reactive gas timing rf magnetron sputtering, with two conditions: (1) a time period of Ar∶N2 gas (2) a flow rate of Ar∶N2 gas. Our results show that sputter rate increase with increasing of a time period and the rate of Ar∶N2 gas. The crystal structure of thin films was investigated by x-ray diffraction show fcc structure of Ni3FeN (200) plane. The lattice constants increase with increasing of the flow rate of the nitrogen gas but it decrease with increasing of a time period of Ar gas. The grain size of thin films were investigated by atomic force microscope show the size range between 20 – 120 nm.
反应气体定时射频磁控溅射制备Ni3FeN薄膜及表征
采用反应气体定时射频磁控溅射的方法,在室温条件下在玻璃基板上沉积Ni3FeN薄膜,条件为:(1)Ar∶N2气体的时间周期(2)Ar∶N2气体的流速。结果表明,溅射速率随时间的增加和Ar∶N2气体掺量的增加而增加。用x射线衍射研究了薄膜的晶体结构,发现了Ni3FeN(200)平面的fcc结构。晶格常数随氮气流速的增大而增大,随氩气流速的增大而减小。用原子力显微镜观察了薄膜的晶粒尺寸,晶粒尺寸范围在20 ~ 120 nm之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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