Horizontal systems: Leading technology for next generation HDI production

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382265

S. Kenny, T. Magaya

引用次数: 0

Abstract

The developments in high density interconnect, HDI technology are characterized by the following: - Ever higher packaging density. - Reduction in line and space. - New dielectrics to meet high frequency demands. - Employment of thinner substrates. - Environmental and legislative impact. - Requirement for high overall process yields. - Demand for continuous reduction in process costs.

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水平系统:下一代HDI生产的领先技术

高密度互连，HDI技术的发展具有以下特点:-更高的封装密度。-减少行和空间。-新型电介质，满足高频需求。-采用更薄的基材。-环境和立法影响。-对高整体工艺良率的要求。-持续降低工艺成本的需求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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