Investigation on the effect of nickel and nickel-chromium alloy pulse current plating on copper substrate

C. Sherwin, S. Chakraborty, K. Raju, S. Bhat, Sudheendra P. Hebbar
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Abstract

ABSTRACT In the present study, nanocrystalline nickel (Ni) and nickel-chromium (Ni-Cr) alloy coatings were developed on copper (Cu) substrate using pulse current. The pulse current parameters include a cycle time of 240 milliseconds at a duty cycle of 0.5 and 4.17 Hz frequency. The surface morphology, texture, hardness, scratch resistance and porosity were investigated for different coatings developed by pulse plating. Energy Dispersive Spectroscopy (EDS) analysis revealed good quality Ni and Ni-Cr alloy coatings developed on the copper substrate. The peak current of the pulse has been observed to have an impact on the coating weight and thickness. The micrographs of the coatings explored under Field Emission Scanning Electron Microscopy (FESEM), depict uniform coatings consisting of fine primary and coarse secondary granules of Ni and Cr. The hard primary and secondary Ni granules deposited on the surface of Cu increase its hardness, corrosion and wear resistance. Further, it was observed that the Ni-Cr alloy plated samples are harder and less porous in nature compared to Ni plated samples.
脉冲电流镀镍及镍铬合金在铜基体上的效果研究
本研究采用脉冲电流在铜(Cu)衬底上制备了纳米晶镍(Ni)和镍铬(Ni- cr)合金涂层。脉冲电流参数包括在占空比为0.5和4.17 Hz频率下240毫秒的周期时间。研究了脉冲镀不同镀层的表面形貌、织构、硬度、耐划伤性和孔隙率。能谱分析表明,在铜基体上形成了质量良好的Ni和Ni- cr合金涂层。脉冲的峰值电流已经被观察到对涂层的重量和厚度有影响。在场发射扫描电镜(FESEM)下对镀层进行了显微观察,发现镀层由细小的一次镍和粗的二次镍颗粒组成。Cu表面沉积的坚硬的一次镍和二次镍颗粒提高了Cu的硬度、耐蚀性和耐磨性。此外,我们还观察到镀镍铬合金的样品比镀镍的样品更硬,多孔性更小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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