Solder Paste Transfer Via Pattern Tape Technology

Abstract

Stencil Printing Technology is currently a high throughput process for solder or adhesive materials deposition used in SMT and bumping process. With growth of heterogenous integration in the advanced semiconductor packaging is driving more stringent fine pitch application requirements. Disadvantages of Stencil Printing Technology for ultrafine pitch application, i.e. MicroLED Chip Attach, is restricted by stencil design (opening size) which resulted in frequent clogging of stencil and thus increase cost. Hence a “stencil-less” technology for solder paste deposition via novel tape or film transfer process will be studied in this work. The paste transfer under development will require the use of low temperature profile to enable paste to deposit onto the substrate (receiver) and maintain structural integrity, probably in a semi state of paste form which can be subjected for Si die or microchip attach for reflow soldering to complete good solder interconnection during mass assemblies process.