Junyi Li, Hong Wang, Huiying Wang, Z. Zhang, P. Cheng, G. Ding
{"title":"Design and fabrication of Cu-TSV free-standing specimen for uniaxial micro-tensile test","authors":"Junyi Li, Hong Wang, Huiying Wang, Z. Zhang, P. Cheng, G. Ding","doi":"10.1109/ISAPM.2011.6105725","DOIUrl":null,"url":null,"abstract":"A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4∼32.9GPa and 574∼764MPa, respectively.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105725","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operation. The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Young's modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4∼32.9GPa and 574∼764MPa, respectively.