SoC compatible 1 T1 C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2

J. Okuno, Takafumi Kunihiro, Kenta Konishi, Hideki Maemura, Yusuke Shute, Fumitaka Sugaya, M. Materano, T. Ali, Kati Kuehnel, Konrad Seide, U. Schroeder, T. Mikolajick, M. Tsukamoto, T. Umebayashi
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引用次数: 40

Abstract

This paper experimentally demonstrates fundamental memory array operation of a ferroelectric HfO2-based 1 T1 C FeRAM. Metal/ferroelectric/metal (MFM) capacitors consisting of a TiN/ $\mathrm{Hf}_{0.5}\mathrm{Zr}_{0.5}\mathrm{O}_{2}(\mathrm{HZO}$)/TiN stack were optimized for a sub 500°C process. Structures revealed excellent performance such as remanent polarization $2\mathrm{P}_{\mathrm{r}} > 4\vert \mu\mathrm{C}/\mathrm{cm}^{2}$, endurance> 1011 cycles, and 10 years data retention at 85°C. Furthermore, the MFM capacitors were successfully integrated into a 64 kbit 1T1C FeRAM array including our dedicated circuit for array operation. Back-end-of-line (BEOL) wiring showed no degradation of the underlying CMOS logic. Program and read operation were properly controlled resulting in 100 % bit functionality at an operation voltage of2.5 Vand operating speed at 14 ns. This technology matches requirements of last level cash (LLC) and embedded non-volatile-memory (NVM) in low power System-on-a-Chip (SoC) for IoT applications.
基于铁电f0.5 zr0.5 o2的SoC兼容1t1 C FeRAM存储阵列
实验证明了铁电hfo2基1t1 C FeRAM的基本存储阵列操作。优化了TiN/ $\ mathm {Hf}_{0.5}\ mathm {Zr}_{0.5}\ mathm {O}_{2}(\ mathm {HZO}$)/TiN堆栈组成的金属/铁电/金属(MFM)电容器,适用于低于500℃的工艺。结构显示出优异的性能,如剩余极化$2\ mathm {P}_{\ mathm {r}} > 4\vert \mu\ mathm {C}/\ mathm {cm}^{2}$,续航时间> 1011次,在85°C下数据保留10年。此外,MFM电容器已成功集成到64 kbit 1T1C FeRAM阵列中,包括用于阵列操作的专用电路。后端线(BEOL)布线显示底层CMOS逻辑没有退化。程序和读取操作得到了适当的控制,在2.5 v的工作电压和14 ns的工作速度下实现了100%的位功能。该技术符合低功耗片上系统(SoC)中用于物联网应用的最后一级现金(LLC)和嵌入式非易失性存储器(NVM)的要求。
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