An alternative to Tungsten in 3D-NAND technology

2021 IEEE International Interconnect Technology Conference (IITC) Pub Date : 2021-07-06 DOI:10.1109/IITC51362.2021.9537409

Suhr Dominique, Mevellec Vincent, Thiam Mikailou, Idier Jonathan, Raynal Frédéric, Berthon Hermine, Perrault Elisa, Hann Nicolas, Doussot Céline, Kim Yeeseul, Baus Mathilde, Lakhdari Amine, Guittet Gaëlle, Caillard Louis

引用次数: 0

Abstract

As the number of wordlines has reached 128 layers in the realm of 3D-NAND, several challenges have emerged to produce these structures. Among these is metallization of the connection made with Tungsten. This paper explores Nickel alloys as an alternative metal. Several key data are presented to validate this new concept.

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3D-NAND技术中钨的替代品

随着3D-NAND领域的字行数量达到128层，生产这些结构出现了一些挑战。其中包括用钨制成的连接的金属化。本文探讨了镍合金作为一种替代金属。提出了几个关键数据来验证这个新概念。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 IEEE International Interconnect Technology Conference (IITC)

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