Design for the enhancement of anti-vibration characteristics of surface mount type electronic components

Abstract

The vibration environment will cause damage firstly at all corner's solder balls in BGA components. Some of researches replaced the corner solder balls with larger ones or solder columns to reduce stress, or even just placed a solder ball without electrical function on corners to bear stresses. But all these designs have to modify the existing process in production line just for such special components and thus will increase the cost. This research would use new designs by either adding ribs at component's peripheral or replacing the current heat-spreader on BGAs with elastic metallic sheet to increase the component's rigidity, and also to restrain the vibration induced deformation on PCBs.