{"title":"Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides","authors":"Y. Ito, S. Terada, M. Singh, S. Arai, K. Choki","doi":"10.1109/ECTC.2012.6249038","DOIUrl":null,"url":null,"abstract":"We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.","PeriodicalId":6384,"journal":{"name":"2012 IEEE 62nd Electronic Components and Technology Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 62nd Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2012.6249038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.