Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling

Q4 Engineering

International Journal of Mechatronics and Automation Pub Date : 2016-12-01 DOI:10.1166/jom.2015.1123

Chaobo Shen, Z. Hai, Cong Zhao, Jiawei Zhang, John L. Evans, M. Bozack, J. Suhling

引用次数: 0

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热循环过程中Sn-Ag-Cu焊点表面处理的可靠性研究与失效分析

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

International Journal of Mechatronics and Automation Engineering-Industrial and Manufacturing Engineering

CiteScore

1.60

自引率

0.00%

发文量