Microfabrication using focused ion beams part II

Kenji Gamo, Susumu Namba
{"title":"Microfabrication using focused ion beams part II","authors":"Kenji Gamo,&nbsp;Susumu Namba","doi":"10.1016/0959-3527(90)90183-T","DOIUrl":null,"url":null,"abstract":"<div><p>Soon all semiconductor devices could be made this way is a claim often made for focused ion beam technology. As the Osaka University team relates in this overview, numerous labs around the world have used FIB to dope, deposit, etch and define semiconductor and other films to microfabricate circuits and devices. FIB has yet to become a routine method but the techniques under this banner hold much promise for the production of next generation devices.</p></div>","PeriodicalId":100494,"journal":{"name":"Euro III-Vs Review","volume":"3 6","pages":"Pages 47-48"},"PeriodicalIF":0.0000,"publicationDate":"1990-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0959-3527(90)90183-T","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Euro III-Vs Review","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/095935279090183T","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Soon all semiconductor devices could be made this way is a claim often made for focused ion beam technology. As the Osaka University team relates in this overview, numerous labs around the world have used FIB to dope, deposit, etch and define semiconductor and other films to microfabricate circuits and devices. FIB has yet to become a routine method but the techniques under this banner hold much promise for the production of next generation devices.

聚焦离子束微细加工。第二部分
很快,所有的半导体设备都可以用这种方式制造,这是聚焦离子束技术经常提出的要求。正如大阪大学团队在本概述中所述,世界各地的许多实验室已经使用FIB来掺杂,沉积,蚀刻和定义半导体和其他薄膜,以微制造电路和设备。FIB尚未成为一种常规方法,但在这种旗帜下的技术对下一代设备的生产大有希望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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