Barrier Engineering of Lattice Matched AlInGaN/ GaN Heterostructure Toward High Performance E-mode Operation

N. Shrestha, Chao-Hsuan Chen, Zuo‐Min Tsai, Yiming Li, J. Tarng, S. Samukawa
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Abstract

Electrical characteristics of lattice matched AlInGaN/GaN high electron mobility transistors with different barrier engineering was studied theoretically by solving drift diffusion equation. The results of the study thoroughly disclose the mitigation of induced polarization charge on lowering Al and In content in barrier resulting in a positive shift of threshold voltage with huge deduction on drain current. The newly designed lattice match double A10.54 In0.12 Ga0.34 N/ Al0.18 In0.04 Ga0.78 N barrier recess gate HEMT helps to boost the drain current by reducing the access resistance and enhancing the polarization charge density. The proposed HEMT exalted current density and transconductance by two times with significant shift of threshold voltage in positive axis than that of single barrier structure. Conclusively, the high performance novel double barrier recess gate E-mode HEMT will be key for real and efficient high power switching application.
面向高性能e模运行的晶格匹配AlInGaN/ GaN异质结构势垒工程
通过求解漂移扩散方程,从理论上研究了不同势垒工程下晶格匹配AlInGaN/GaN高电子迁移率晶体管的电学特性。研究结果充分揭示了降低势垒中Al和In含量对诱导极化电荷的抑制作用,导致阈值电压正向偏移,漏极电流大幅减少。新设计的晶格匹配双A10.54 In0.12 Ga0.34 N/ Al0.18 In0.04 Ga0.78 N势垒凹槽栅极HEMT通过降低通路电阻和提高极化电荷密度来提高漏极电流。与单势垒结构相比,HEMT的电流密度和跨导提高了两倍,且阈值电压在正轴上有显著的位移。总之,高性能的新型双势垒凹槽栅e模HEMT将是实现真正高效的大功率开关应用的关键。
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