Evaluation of material property requirements and performance of ultra-low dielectric constant insulators for inlaid copper metallization

Abstract

Technological challenges for selection and integration of ultra-low dielectric constant insulators are discussed. Correlations of material properties with their performance in 1 level-metal inlaid copper integration are established. Dielectric constants of candidate materials are estimated from line-to-line capacitance measurements and FEM. Implications regarding the changes in dielectric constant are discussed.