Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding Assembly

F. Le, Haibin Chen, Zunyu Guan, F. Fajardo
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Abstract

Most fluxes and their flux residue are corrosive, and their presence on the surface of assemblies may cause reliability concerns due to electrochemical migration. This study firstly refers to the test method IPC-TM-650 2.3.32D and 2.6.15C and the requirements in J-STD-004A to evaluate flux-induced corrosion and the corrosivity of their flux residue. Then thermogravimetric analysis is used to evaluate the flux residue level after soldering under identical conditions. These comparison data can be utilized to compare flux performance of solder pastes. For the cleanliness evaluation after flux cleaning, the qualitative analysis refers to IPC-A-610G and adopts optical inspection to observe the flux cleaning effect. The quantitative analysis refers to IPC-TM-650 2.3.28B ion chromatography test method to analyze the level of ionic species after flux cleaning. In addition to IPC-TM-650 2.3.28B ion chromatography method, the effectiveness of other methods has been well demonstrated to characterize the fluxes and their flux residue in clip bonding assembly.
焊接焊剂腐蚀性和焊剂残留水平的评估
大多数助焊剂及其残余物具有腐蚀性,它们在组件表面的存在可能由于电化学迁移而引起可靠性问题。本研究首先参照IPC-TM-650 2.3.32D和2.6.15C的试验方法,以及J-STD-004A的要求,对其熔剂残渣的腐蚀性能进行评价。然后用热重分析法对相同条件下焊接后的助焊剂残留量进行了评价。这些比较数据可用于比较焊膏的助焊剂性能。对助焊剂清洗后的清洁度评价,定性分析参照IPC-A-610G,采用光学检测观察助焊剂清洗效果。定量分析参照IPC-TM-650 2.3.28B离子色谱测试方法,分析助焊剂清洗后的离子种类水平。除了IPC-TM-650 2.3.28B离子色谱法外,其他方法也能很好地表征夹接过程中焊剂及其残留。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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