Structural and Electrical Demonstration of SiGe Cladded Channel for PMOS Stacked Nanosheet Gate-All-Around Devices

S. Mochizuki, B. Colombeau, J. Zhang, S. Kung, M. Stolfi, H. Zhou, M. Breton, K. Watanabe, J. Li, H. Jagannathan, M. Cogorno, T. Mandrekar, P. Chen, N. Loubet, S. Natarajan, B. Haran
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引用次数: 4

Abstract

In this paper, horizontal gate-all-around (hGAA) devices with a SiGe cladded nanosheet (NS) channel have been explored for their potential benefits of Vt modulation and improved NBTI. The SiGe cladded NS channel was formed through trimming of the Si NS channel followed by selective SiGe epitaxial growth. Selective Si NS channel trimming of 1 - 2 nm per side with low roughness and conformal SiGe cladding epitaxial growth of 2 - 3 nm with good crystallinity were demonstrated. It is shown that a SiGe cladding NS channel provides a reduction of threshold voltage (Vt) and improved reliability. It is also shown that a conformal Si cap grown on the SiGe cladded NS channel suppresses the interface trap density (Dit).
PMOS层叠纳米片栅极全能器件SiGe包层通道的结构与电学论证
本文研究了具有SiGe包层纳米片(NS)通道的水平栅全能(hGAA)器件,以探索其Vt调制和改进NBTI的潜在优势。SiGe包覆的NS沟道是通过对Si NS沟道进行修剪,然后进行选择性的SiGe外延生长形成的。在低粗糙度的条件下,单侧1 ~ 2 nm的选择性Si - NS沟道修剪和2 ~ 3 nm的适形SiGe包层外延生长具有良好的结晶度。结果表明,SiGe包层NS通道降低了阈值电压,提高了可靠性。在SiGe包覆的NS通道上生长的共形Si帽抑制了界面阱密度(Dit)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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