Preparation of copper clad laminates with high performance bismaleimide-based copolymer matrix resins

Abstract

4,4′-Diphenyl Bismaleimide/Diallyl Bisphenol A/Bisphenol-A Cyanate Ester/Epoxy Resin copolymer matrix resins were developed by fusion prepolymerization and solution prepolymerization method, and use the bismaleimide (BMI)-based copolymer matrix resins/glass fabric prepared for copper clad laminates, which illustrate Tg at 230.7°C, dielectric constant at 3.57(1MHz) and dielectric loss constant at 0.0053(1MHz), volume resistivity at 2.3×1013Ω·cm and surface resistivity at 2.4×1015Ω, thermal expansion coefficient at 1.1×10–5/°C (x y-axis) and 5.7×10–5/°C (z-axis), dip soldering of resistance(288°C) is more than 62s, peel strength at 16.7N/cm, flexural strength at 458.3MP, moisture absorption at 0.19%, the test results explain that the performance is better than Japanese product copper clad laminates with bismaleimide/triazine-based resin(BT resin).