A Fast Calculation Model for Parasitic Inductance of SiC Power Devices

Lei Song, M. Cai, Hengjian He, Kailin Zhang
{"title":"A Fast Calculation Model for Parasitic Inductance of SiC Power Devices","authors":"Lei Song, M. Cai, Hengjian He, Kailin Zhang","doi":"10.1109/SSLChinaIFWS54608.2021.9675187","DOIUrl":null,"url":null,"abstract":"Silicon carbide (SiC) power device has a leap forward improvement in various performance indexes compared with the existing silicon-based power devices, and is suitable for higher frequency working occasions. Its high switching speed makes it more sensitive to stray parameters and easier to cause voltage and current oscillation. Therefore, reducing the inductance of power module has become the key to module design. Usually when designing the layout of the power module, it is necessary to establish the 3d model and then use the Q3d software to extract the internal circuit inductance of the device. The process is complicated and the design cycle is long. To solve this problem, this article focuses on the rapid evaluation method of loop inductance in the process of power module layout design, and proposes a faster, simpler, and relatively accurate calculation model based on the existing theories - Inductance Calculation Model of Arbitrary Shape Open-loop Circuit. Then, the convenience and accuracy of the equivalent closed loop model are verified by calculating three different IGBT layout loop inductances. This method is conducive to the rapid iteration of the power module layout design and shortens the design cycle.","PeriodicalId":6816,"journal":{"name":"2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS)","volume":"102 1","pages":"29-32"},"PeriodicalIF":0.0000,"publicationDate":"2021-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLChinaIFWS54608.2021.9675187","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Silicon carbide (SiC) power device has a leap forward improvement in various performance indexes compared with the existing silicon-based power devices, and is suitable for higher frequency working occasions. Its high switching speed makes it more sensitive to stray parameters and easier to cause voltage and current oscillation. Therefore, reducing the inductance of power module has become the key to module design. Usually when designing the layout of the power module, it is necessary to establish the 3d model and then use the Q3d software to extract the internal circuit inductance of the device. The process is complicated and the design cycle is long. To solve this problem, this article focuses on the rapid evaluation method of loop inductance in the process of power module layout design, and proposes a faster, simpler, and relatively accurate calculation model based on the existing theories - Inductance Calculation Model of Arbitrary Shape Open-loop Circuit. Then, the convenience and accuracy of the equivalent closed loop model are verified by calculating three different IGBT layout loop inductances. This method is conducive to the rapid iteration of the power module layout design and shortens the design cycle.
SiC功率器件寄生电感的快速计算模型
碳化硅(SiC)功率器件与现有的硅基功率器件相比,各项性能指标有了跨越式的提高,适用于更高频率的工作场合。它的高开关速度使其对杂散参数更敏感,更容易引起电压和电流的振荡。因此,减小功率模块的电感成为模块设计的关键。通常在设计电源模块的布局时,需要建立三维模型,然后使用Q3d软件提取器件的内部电路电感。过程复杂,设计周期长。针对这一问题,本文重点研究了功率模块布置图设计过程中环路电感的快速评估方法,并在现有理论的基础上提出了一种更快、更简单、相对准确的计算模型——任意形状开环电路电感计算模型。然后,通过计算三种不同IGBT布局的环路电感,验证了等效闭环模型的方便性和准确性。该方法有利于电源模块版图设计的快速迭代,缩短了设计周期。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信