CMOS Compatible Process Integration of SOT-MRAM with Heavy-Metal Bi-Layer Bottom Electrode and 10ns Field-Free SOT Switching with STT Assist

N. Sato, G. Allen, William P. Benson, B. Buford, Atreyee Chakraborty, M. Christenson, T. Gosavi, P. Heil, N. Kabir, B. Krist, K. O’Brien, K. Oguz, Rohan Patil, J. Pellegren, A. Smith, E. S. Walker, P. Hentges, M. Metz, M. Seth, B. Turkot, C. Wiegand, H. Yoo, I. Young
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引用次数: 12

Abstract

This paper demonstrates a CMOS compatible process integration of spin-orbit torque (SOT) device with a unique bilayer SOT bottom electrode. An effective spin-Hall angle of 0.27, a median tunneling magneto-resistance ratio of 127% at electrical CD of 57 nm, and a 96% resistance-based MTJ yield on 300 mm scale were achieved. We experimentally validated the two-pulse field-free SOT switching scheme with spin-transfer torque assist at 10ns. Unlike conventional field-free SOT switching schemes, the demonstrated scheme adds no complexity to process integration.
含重金属双层底电极的SOT- mram与STT辅助的10ns无场SOT开关的CMOS兼容工艺集成
介绍了一种采用独特的双层SOT底电极的CMOS兼容自旋轨道转矩(SOT)器件的工艺集成。在57 nm的电CD下,有效自旋-霍尔角为0.27,中位隧穿磁阻比为127%,在300 mm尺度上实现了96%的电阻基MTJ产率。我们通过实验验证了10ns自旋传递扭矩辅助的双脉冲无场SOT开关方案。与传统的无现场SOT开关方案不同,所演示的方案不会增加工艺集成的复杂性。
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