Non-destructive fault isolation in through-silicon interposer based system in package

Abstract

The importance of IC packaging technologies within semiconductor manufacturing has increased dramatically over the last decade. Advanced packaging, including 2.5D ICs, is becoming more widely used due to its integrated functionality. However, due to the complexity of the advanced package architectures, it also poses challenges in localizing the defect, which is required for the successful investigation of faults. In this paper, an approach to accurately localize the failures in 2.5-D integrated system-in-package is presented. Two different case studies are discussed to demonstrate fault isolation, the first one with a short defect at the die, and the second one having an open defect at the substrate. The proposed method to locate faults rapidly with an accuracy of less than $10\mu\mathrm{m}$ will provide an effective solution for investigating yield-loss in advanced packages.