Joseph Tang, H. Sezer, N. Ahsan, Hossain Ahmed, S. Kaul
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引用次数: 0
Abstract
In this paper, maximum stresses from the Direct Metal Laser Sintering (DMLS) process are numerically calculated for each layer using a novel computational model that has been developed to capture the layer-by-layer deposition. The computational domain with all layers is modeled numerically with conduction, while using convection and radiation on the model boundaries. The phase change of the material between liquid and solid states is accounted for and the residual thermal stresses are obtained from the temperature gradient data in conjunction with Hooke’s law. The resulting maximum stress versus time behavior and maximum stress distribution patterns on each layer are complex and do not always match the scanning path. However, there is direct correspondence between the stress distribution and the scanning patterns.
期刊介绍:
The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.