Controlled Wetting of Spread Powder and its Impact on Line Formation in Binder Jetting

IF 1 Q4 ENGINEERING, MANUFACTURING

Journal of Micro and Nano-Manufacturing Pub Date : 2022-06-27 DOI:10.1115/msec2022-85603

Colton Inkley, David G. Martin, Brennen Clark, N. Crane

{"title":"Controlled Wetting of Spread Powder and its Impact on Line Formation in Binder Jetting","authors":"Colton Inkley, David G. Martin, Brennen Clark, N. Crane","doi":"10.1115/msec2022-85603","DOIUrl":null,"url":null,"abstract":"\n Binder Jetting (BJ) has increased in popularity and capability since its development at MIT as it offers advantages such as fast build rates, integrated overhang support, low-power requirements, and versatility in materials. However, defects arise during layer spreading and printing that are difficult to remove during post-processing. Many of these defects are caused by particle rearrangement/ejection during binder deposition. This study explores methods of reducing particle rearrangement and ejection by applying small amounts of moisture to increase the cohesive forces between powder particles. A moisture application system was built using a piezo-electric disk to atomize water to apply a desired liquid to the BJ powder bed without disruption. The moisture is applied after spreading a new layer. Lines of binder were printed using varying droplet spacings and moisture levels. Results show that the moisture delivery system applied moisture levels across the entire application area with a standard deviation under 23%. The moisture levels delivered also had a single position test-to-test uniformity standard deviation under 21%. All tested levels of moisture addition showed mitigation of the balling defects observed in lines printed using dry powder under the same parameters. Moisture addition decreased effective saturation and increased line dimensions (height and width), but lines printed using the smallest amount of moisture tested, showed similar saturation levels and line widths to lines printed in dry powder while still partially mitigating balling.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":null,"pages":null},"PeriodicalIF":1.0000,"publicationDate":"2022-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micro and Nano-Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/msec2022-85603","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}

引用次数: 2

Abstract

Binder Jetting (BJ) has increased in popularity and capability since its development at MIT as it offers advantages such as fast build rates, integrated overhang support, low-power requirements, and versatility in materials. However, defects arise during layer spreading and printing that are difficult to remove during post-processing. Many of these defects are caused by particle rearrangement/ejection during binder deposition. This study explores methods of reducing particle rearrangement and ejection by applying small amounts of moisture to increase the cohesive forces between powder particles. A moisture application system was built using a piezo-electric disk to atomize water to apply a desired liquid to the BJ powder bed without disruption. The moisture is applied after spreading a new layer. Lines of binder were printed using varying droplet spacings and moisture levels. Results show that the moisture delivery system applied moisture levels across the entire application area with a standard deviation under 23%. The moisture levels delivered also had a single position test-to-test uniformity standard deviation under 21%. All tested levels of moisture addition showed mitigation of the balling defects observed in lines printed using dry powder under the same parameters. Moisture addition decreased effective saturation and increased line dimensions (height and width), but lines printed using the smallest amount of moisture tested, showed similar saturation levels and line widths to lines printed in dry powder while still partially mitigating balling.

查看原文本刊更多论文

涂敷粉的可控润湿及其对粘结剂喷射成形的影响

粘结剂喷射(BJ)自麻省理工学院(MIT)开发以来，由于其具有快速构建速度、集成悬架支撑、低功耗要求和材料多功能性等优点，因此越来越受欢迎，性能也越来越强。然而，在铺层和印刷过程中会产生缺陷，在后处理过程中难以消除。许多这些缺陷是由粘结剂沉积过程中的颗粒重排/喷射引起的。本研究探讨了通过施加少量水分来增加粉末颗粒之间的凝聚力来减少颗粒重排和喷射的方法。利用压电盘雾化水，在不破坏BJ粉末床的情况下，将所需的液体应用于BJ粉末床。在涂上一层新膜后再涂上水分。使用不同的液滴间距和湿度水平印刷粘合剂线。结果表明，水分输送系统在整个应用区域施加的水分水平的标准偏差在23%以下。提供的湿度水平也具有单位置测试到测试均匀性标准偏差在21%以下。所有测试的水分添加水平都表明，在相同参数下使用干粉印刷的线条中观察到的起球缺陷有所缓解。添加水分降低了有效饱和度，增加了线条尺寸(高度和宽度)，但使用最小水分测试的线条显示出与干粉印刷的线条相似的饱和度和线条宽度，同时仍然部分减轻了起球。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-

CiteScore

2.70

自引率

0.00%

发文量

期刊介绍： The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.