Characterization of Stress Shielding in Pressure-Assisted Ceramic Binder Jetting

IF 1 Q4 ENGINEERING, MANUFACTURING
L. Kirby, F. Fei, Xuan Song
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引用次数: 0

Abstract

Ceramic binder jetting processes have inherent limitations in achieving high density due to the low packing density of the powder bed. An emerging route to mitigate the low packing density in ceramic binder jetting entails uniaxial compaction of newly spread powder layers prior to ink deposition. The introduction of layerwise pressure induced a stress shielding effect, i.e., unbalanced stresses between the printed region saturated with ink and the surrounding loose powder, which generates heterogeneous stress in the powder bed and ultimately influences the density of the final part. In this paper, we attempt to better understand the stress shielding effect during the compaction of a selectively ink-jetted powder bed as a function of the printing pattern, i.e., ratio of printed to unprinted sector. Our findings reveal a decreased print area increased the resulting stress shielding effect. Additionally, when pressed without neighboring dry powder, a printed region experienced a much higher stress than the hybrid composition. The dry powder experienced the opposite effect, where when pressed alone, the dry powder had a much lower stress than when pressed with saturated powder. Findings will assist in density prediction and print pattern determination of compacted binder jetted ceramics.
压力辅助陶瓷粘结剂喷射应力屏蔽特性研究
陶瓷粘结剂喷射工艺在实现高密度方面有固有的局限性,因为粉末床的填充密度低。一种新兴的途径,以减轻低堆积密度在陶瓷粘合剂喷射需要单轴压实新扩散的粉末层之前,油墨沉积。分层压力的引入引起了应力屏蔽效应,即在油墨饱和的印刷区域与周围的松散粉末之间产生不平衡的应力,从而在粉末床中产生非均匀应力,最终影响最终零件的密度。在本文中,我们试图更好地理解在选择性喷墨粉末床压实过程中的应力屏蔽效应作为印刷图案的函数,即印刷扇区与未印刷扇区的比例。我们的研究结果表明,减小的打印面积增加了产生的应力屏蔽效果。此外,当没有邻近的干粉压制时,印刷区域经历的应力比混合成分高得多。干粉则有相反的效果,当单独按压时,干粉的应力要比用饱和粉末按压时小得多。研究结果将有助于致密粘结剂喷射陶瓷的密度预测和印刷图案的确定。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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