Electro-Deposition of Thin Si and Ge Films Based on Ballistic Hot Electron Injection

N. Koshida, A. Kojima, T. Ohta, Romain Mentek, B. Gelloz, N. Mori, J. Shirakashi
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引用次数: 7

Abstract

Apart from the conventional dry process such as chemical vapor deposition (CVD), some electrochemical approaches have been conducted to fabricate thin Si and Ge films. The liquids used to date for electro-deposition of those films are nonaqueous organic electrolytes, 1‐4 tetrachloride solutions (SiCl4, GeCl4), 5,6 ionic liquids, 7‐13 aqueous solutions, 14 and molten salt solutions. 15‐17 In every case, however, deposited films show non-uniform, porous, or contaminant features in structure and composition. Nanocrystalline silicon (nc-Si) diode acts as a planar cold cathode which uniformly emits ballistic hot electrons. 18 The nc-Si emitter is composed of a thin Au (10 nm), an anodized nc-Si layer (∼1 μm), a
基于弹道热电子注入的硅锗薄膜电沉积研究
除了化学气相沉积(CVD)等传统的干法外,还采用了一些电化学方法来制备硅和锗薄膜。迄今为止,用于电沉积这些薄膜的液体是非水有机电解质、1‐4四氯溶液(SiCl4、GeCl4)、5,6离子液体、7‐13水溶液、14和熔盐溶液。15‐17然而,在每种情况下,沉积的薄膜在结构和组成上都表现出不均匀、多孔或污染的特征。纳米晶硅(nc-Si)二极管作为平面冷阴极均匀发射弹道热电子。纳米硅发射极由薄Au层(10 nm)、阳极氧化的纳米硅层(~ 1 μm)、a和a组成
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来源期刊
ECS Solid State Letters
ECS Solid State Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-PHYSICS, APPLIED
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