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Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration

Q4 Engineering
IPSJ Transactions on System LSI Design Methodology Pub Date : 2017-01-01 DOI:10.2197/IPSJTSLDM.10.45
J. Knechtel, O. Sinanoglu, I. Elfadel, J. Lienig, C. Sze
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引用次数: 33
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大规模3D芯片:设计自动化、测试和可信赖集成的挑战和解决方案
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来源期刊
IPSJ Transactions on System LSI Design Methodology
IPSJ Transactions on System LSI Design Methodology Engineering-Electrical and Electronic Engineering
CiteScore
1.20
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0.00%
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