Multi-scan cyclic voltammetry to roughen the surface of copper foil for application in copper-clad laminates

Abstract

ABSTRACT Multi-scan cyclic voltammetry is proposed to prepare copper foils with a matte side for use in copper-clad laminates (CCLs). During multi-scan cyclic voltammetry at −1 V ∼ 0.5 V at 80°C, the shiny side of electrolytic copper foil was subjected to zinc deposition, zinc–copper interdiffusion (alloying), and zinc dissolution (de-alloying) processes. After 21 CV cycles (315 s), small islands with a height range of 0.5∼2 μm and irregular voids formed on the matte side of the copper foil. The prepared copper foil had a specific surface area of 2.39 m2 g−1 as measured by N2 adsorption and desorption, which is greater than that of commercial copper foil with a matte side. When the copper foil was laminated as CCL, the prepared CCL had an average peel strength of 1.92 N mm−1, indicating that this route could be used for high-performance CCLs.