Fabrication and Characterization of ISC embedded Interposer for High Performance Interconnection

Abstract

Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack capacitor (ISC) embedded interposer system was demonstrated with the approximately 8 times higher capacitance (Ci) than interposer with MIM (Metal / Insulator / Metal capacitor). The resistance and leakage current were measured and the results indicate that there were no the open fail inside the system. In addition, WLR (Wafer Level Reliability) was proved using TDDB (Time Dependent Dielectric Breakdown), Vramp, HTS (High Temperature Storage), TC (Thermal Cycle) and Pre-con tests and finally, all requirements of WLR are satisfied.