Investigation of Thermal Performance of Antenna in Package for Automotive Radar System

Abstract

Antenna-in-Package (AiP) technology has emerged as the mainstream advanced package integrated with antenna and transceiver die for automotive radar application. In this work, thermal performance investigation has been performed on three types of AiP. The effects of underfill material, PCB, RDL, and solder array on package thermal performance has been studied, as well as the combined effects of multiple factors. According to the thermal affecting factors analysis, thermal performance improvement solution has been suggested. All 3 types of package have been analyzed. By using the improvement solution obtained from this analysis, the maximum chip temperature rise can be reduced by ∼20%, and the package internal resistance can be reduced by ∼15%.