Compartmental EMI Shielding with Jet-Dispensed Material Technology

Abstract

Device miniaturization continues using System-on-Chip (SoC), System-in-Package (SiP), multichip module (MCM), and heterogeneous integration to deliver a wider range of functionalities without sacrificing valuable space on a substrate. With multiple integrated circuits and MEMS sensors integrated into a thin single module to perform as a full electronic system, the need for more compact and effective electromagnetic interference (EMI) protection between various baseband and wireless, RF, analog, and power management components is greater than ever before. Fortunately, as device miniaturization has accelerated, so has the development of novel shielding technologies to accommodate for the higher density package structures. Jet-dispensed compartment shielding is an integrated package-level solution that allows for much smaller semiconductor form factors and is achieved using a fully automatic assembly process with high performance.