Reconsideration of Enamel Etching Protocols for Universal Adhesives: Effect of Etching Method and Etching Time.

Y. Shimatani, A. Tsujimoto, Kie Nojiri, K. Shiratsuchi, T. Takamizawa, W. Barkmeier, M. Latta, M. Miyazaki
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引用次数: 8

Abstract

PURPOSE To evaluate whether different etching methods with reduced etching times would improve the enamel bonding efficacy of universal adhesives. MATERIALS AND METHODS Three enamel etching methods were evaluated - 1. phosphoric acid ester monomer etching (PPM); 2. phosphoric acid etching (PPA); and 3. polyalkenoic acid etching (PLA) - as were three universal adhesives: 1. BeautiBond Universal (BU); 2. Prime&Bond elect (PE); and 3. Scotchbond Universal Adhesive (SU). The shear bond strengths of the universal adhesives to ground enamel and ground enamel etched for 1, 5, 10, and 15 s with different etching methods were determined after 24 h and 10,000 thermal cycles. Surface roughness average (Ra) and surface area ratio (surface area:planar area) were measured using a confocal laser scanning microscope. Field-emission scanning electron microscope (FE-SEM) observations of enamel with different etching protocols were also conducted. RESULTS The bond strengths of universal adhesives to enamel subjected to PPA etching with maximum times of 1-15 s and PLA etching for 15 s were significantly higher than those to ground enamel. The bond strength to enamel subjected to PPM etching did not increase and was similar to that for ground enamel. PPA and PLA etching were effective at increasing the Ra and surface area ratio of enamel. Although both values were significantly higher than those of ground enamel, those subjected to PPA etching were significantly higher than those which underwent PLA etching. In addition, the Ra and surface area of enamel subjected to PPM etching were similar to those of ground enamel, regardless of the etching time. CONCLUSIONS Phosphoric acid etching for <1-15 s and polyalkenoic-acid etching for 15 s both improve the bonding of universal adhesives, the Ra, and the surface area ratio of enamel. However, phosphoric acid ester monomer etching was not effective, regardless of the etching time.
通用胶粘剂珐琅蚀刻方案的重新考虑:蚀刻方法和蚀刻时间的影响。
目的探讨不同的蚀刻方法在减少蚀刻次数的情况下,是否能提高通用胶粘剂的牙釉质粘接效果。材料与方法对三种牙釉质蚀刻方法进行了评价。磷酸酯单体腐蚀(PPM);2. 磷酸腐蚀(PPA);和3。聚烯酸蚀刻(PLA) -三种通用胶粘剂:1。BeautiBond Universal (BU);2. 优质债券(PE);和3。Scotchbond万能胶(SU)。在24 h和10000次热循环后,测定了通用胶粘剂与不同蚀刻方法蚀刻1、5、10和15 s的地釉和地釉的剪切粘接强度。用共聚焦激光扫描显微镜测量表面粗糙度平均值(Ra)和表面积比(表面积:平面面积)。对不同蚀刻方式的牙釉质进行了场发射扫描电镜(FE-SEM)观察。结果经PPA刻蚀1 ~ 15s和PLA刻蚀15s的通用胶粘剂与牙釉质的结合强度显著高于与研磨牙釉质的结合强度。经PPM腐蚀处理后,其与珐琅质的结合强度没有增加,与地面珐琅质的结合强度相似。PPA和PLA刻蚀均能有效提高牙釉质的Ra和比表面积。虽然这两个值都显著高于磨牙釉质,但经PPA蚀刻的牙釉质明显高于经PLA蚀刻的牙釉质。此外,无论腐蚀时间如何,经PPM腐蚀的牙釉质的Ra和表面积与地面牙釉质相似。结论<1 ~ 15s的磷酸刻蚀和15s的聚烯酸刻蚀均能改善通用胶粘剂的粘接,提高Ra和牙釉质的比表面积。而磷酸酯单体蚀刻效果不佳,与蚀刻时间无关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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