Emergence of Glass Solutions for 5G and Heterogeneous Integration

Abstract

Glass has been of great interest for advanced packaging and RF applications for many years. Since glass is an insulator, it provides low loss performance particularly at high frequencies in the mmWave. The low roughness and ability to form in thin and large area formats provide opportunities for fine line spacing to enable miniaturization and cost-effectiveness. The challenge to glass adoption has been to establish high volume manufacturing operations. Leveraging the Viaffirm® temporary bond process provides many advantages to enable use of existing processes to fabricate thin glass substrates. Here we describe the process and examples of how it has been used to enable manufacture of devices on thin glass substrates.