Structural and ferroelectric properties of r.f. magnetron sputtered SrBi/sub 2/Ta/sub 2/O/sub 9/ thin films

T. Song, J. Lee, T.S. Kim, H. Jung
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Abstract

Radio-frequency magnetron sputtering was used to deposit SrBi/sub 2/Ta/sub 2/O/sub 9/ ferroelectric thin films on Pt(111)/Ti/SiO/sub 2//Si(100) substrates with 15% Bi/sub 2/O/sub 3/ excess SrBi/sub 2/Ta/sub 2/O/sub 9/ ceramic target. Thin films were deposited at room temperature with argon pressures of 0.5/spl sim/100 mTorr and sputtering power of 200 W. Deposited thin films were post-annealed at 800/spl deg/C for 2 hours in O/sub 2/ atmosphere. Structural properties were investigated with X-ray diffraction techniques. And microstructures were observed by the scanning electron microscope. Crystal orientations and microstructures of the thin films were strongly affected by the argon pressures during the deposition. Ferroelectric properties of the Pt/SrBi/sub 2/Ta/sub 2/O/sub 9//Pt capacitors were obtained. The physical properties of the c-axis oriented and polycrystalline SrBi/sub 2/Ta/sub 2/O/sub 9/ were compared. The c-axis oriented thin films show good ferroelectric properties, (P*/sub r/-P/sup /spl circ///sub r/) and E/sub c/ were 10.4 /spl mu/C/cm/sup 2/ and 50 kV/cm, respectively. And for the polycrystalline thin film, (P*/sub r/-P/sup /spl circ///sub r/) and E/sub c/ were 6.5 /spl mu/C/cm/sup 2/ and 43 kV/cm, respectively.
射频磁控溅射SrBi/sub 2/Ta/sub 2/O/sub 9/薄膜的结构和铁电性能
采用射频磁控溅射技术,在含有15% Bi/sub 2/O/sub 3/过量SrBi/sub 2/Ta/sub 2/O/sub 9/陶瓷靶材的Pt(111)/Ti/SiO/sub 2//Si(100)衬底上沉积SrBi/sub 2/Ta/sub 2/O/sub 9/铁电薄膜。在室温下,氩气压力为0.5/spl sim/100 mTorr,溅射功率为200 W,沉积薄膜。将沉积的薄膜在O/sub / 2气氛中,在800/spl℃下退火2小时。用x射线衍射技术研究了其结构性质。并用扫描电镜观察其显微组织。在沉积过程中,氩气压力对薄膜的取向和微观结构有很大的影响。获得了Pt/SrBi/sub 2/Ta/sub 2/O/sub 9/ Pt电容器的铁电性能。比较了c轴取向和多晶SrBi/sub 2/Ta/sub 2/O/sub 9/的物理性能。c轴取向薄膜表现出良好的铁电性能,(P*/sub r/-P/sup /spl circ///sub r/)和E/sub c/分别为10.4 /spl mu/ c/ cm/sup 2/和50 kV/cm。对于多晶薄膜,(P*/sub r/-P/sup /spl circ///sub r/)和E/sub c/分别为6.5 /spl mu/ c/ cm/sup 2/和43 kV/cm。
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