Variations-tolerant 9T SRAM circuit with robust and low leakage SLEEP mode

Hailong Jiao, Yongmin Qiu, V. Kursun
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引用次数: 10

Abstract

Design of static random access memory (SRAM) circuits is challenging due to the degradation of data stability, weakening of write ability, increase of leakage power consumption, and exacerbation of process parameter variations with CMOS technology scaling. An asymmetrically ground-gated nine-transistor (9T) MTCMOS SRAM circuit is proposed in this paper for providing a low-leakage SLEEP mode with data retention capability. The worst-case static noise margin and write voltage margin are increased by up to 2.52x and 21.84%, respectively, with the asymmetrical 9T SRAM cells as compared to conventional six-transistor (6T) and eight-transistor (8T) SRAM cells under die-to-die process parameter variations in a 65nm CMOS technology. Furthermore, the mean values of static noise margin and write voltage margin are enhanced by up to 2.58x and 21.78% with the new 9T SRAM cells as compared with the conventional 6T and 8T SRAM cells under within-die process parameter fluctuations.
耐变9T SRAM电路,具有鲁棒和低漏SLEEP模式
静态随机存取存储器(SRAM)电路的设计面临着数据稳定性下降、写入能力减弱、泄漏功耗增加以及工艺参数变化加剧等挑战。本文提出了一种非对称地门控九晶体管(9T) MTCMOS SRAM电路,提供具有数据保留能力的低漏睡眠模式。在65纳米CMOS工艺参数变化下,与传统的六晶体管(6T)和八晶体管(8T) SRAM电池相比,不对称9T SRAM电池的最坏情况静态噪声边际和写入电压边际分别增加了2.52倍和21.84%。此外,在模内工艺参数波动下,与传统的6T和8T SRAM电池相比,新型9T SRAM电池的静态噪声裕度和写入电压裕度的平均值分别提高了2.58倍和21.78%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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