Self-assembled silicon networks on plastic

Abstract

We demonstrate the use of self-assembly for low temperature integration of microfabricated silicon components on a plastic substrate. Our method allows for integration of parts made by incompatible microfabrication technologies into a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connections. The mild self-assembly conditions (temperature <100 C, pH /spl sim/3.5) are compatible with most electronics and photonics components.