4H-SiC Tapered-Gate MOSFET with Low ON-resistance and Hight Current Density

Hui Liu, Baoshun Zhang, Jinyan Wang, C. Zeng, Zhiqun Cheng, Z. Dong
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Abstract

In this paper, we developed a tapered-gate SiC VDMOSFET. The upper part of the gate of the new structure is vertical structure, and the lower part is V-shaped structure. In addition, there are also two P+ shielding layers on both sides below the gate. Simulation results reveal that the special structure is more conducive to the flow of electrons to the drift region, and the P+ shield can also protect the gate dielectric layer in the reverse blocking. In the optimized structure, the specific ON-resistance of the device reduced by 12.1%, and the current density increased by 46.6%. The figure of merit (FoM = V2BV/Ron) is 1.27 kV2/mΩ.cm2. The tapered-gate SiC VDMOSFET we designed can obtain higher current density in a smaller area, low ON-Resistance and high breakdown voltage.
具有低导通电阻和高电流密度的4H-SiC锥形栅MOSFET
在本文中,我们开发了一个锥形栅极SiC VDMOSFET。新结构的浇口上部为垂直结构,下部为v形结构。此外,栅极下方两侧还有两层P+屏蔽层。仿真结果表明,特殊的结构更有利于电子流向漂移区,P+屏蔽层也可以在反向阻挡中保护栅极介电层。在优化后的结构中,器件的比导通电阻降低了12.1%,电流密度提高了46.6%。性能值(FoM = V2BV/Ron)为1.27 kV2/mΩ.cm2。我们设计的锥形栅极SiC VDMOSFET可以在更小的面积内获得更高的电流密度,低导通电阻和高击穿电压。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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