{"title":"Residual Stress of Aluminum Thin Films Sputtered on Silicon Wafers Measured by X-Ray Diffraction","authors":"Keisuke Tanaka, K. Ishihara, Y. Akiniwa","doi":"10.1154/S0376030800022679","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":7518,"journal":{"name":"Advances in x-ray analysis","volume":"78 1","pages":"267-279"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in x-ray analysis","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1154/S0376030800022679","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}