Comparison of graphene nanoribbons with Cu and Al interconnects

Ning Wang, C. English, E. Pop
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引用次数: 1

Abstract

We present a comparative study of graphene nanoribbon (GNR) interconnects (ICs) with sub-50 nm copper (Cu) and aluminum (AI) ICs. We extend existing models for all materials in order to understand the physical size effects that occur when the electron mean free path (AMFP) becomes comparable to the IC dimensions. We calibrate such models against the best publicly available data. We find that, depending on geometrical configuration, either Al or GNRs could hold advantages over Cu at linewidths <;10 nm.
石墨烯纳米带与铜和铝互连的比较
我们提出了石墨烯纳米带(GNR)互连(ic)与低于50 nm的铜(Cu)和铝(AI) ic的比较研究。我们扩展了所有材料的现有模型,以了解当电子平均自由程(AMFP)与集成电路尺寸相当时发生的物理尺寸效应。我们根据最好的公开数据来校准这些模型。我们发现,根据几何结构的不同,Al或gnr在线宽< 10 nm处都比Cu具有优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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