Post-silicon diagnosis of segments of failing speedpaths due to manufacturing variations

Lin Xie, A. Davoodi, K. Saluja
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引用次数: 25

Abstract

We study diagnosis of segments on speedpaths that fail the timing constraint at the post-silicon stage due to manufacturing variations. We propose a formal procedure that is applied after isolating the failing speedpaths which also incorporates post-silicon path-delay measurements for more accurate analysis. Our goal is to identify segments of the failing speedpaths that have a post-silicon delay larger than their estimated delays at the pre-silicon stage. We refer to such segments as “failing segments” and we rank them according to their degree of failure. Diagnosis of failing segments alleviates the problem of lack of observability inside a path. Moreover, root-cause analysis, and post-silicon tuning or repair, can be done more effectively by focusing on the failing segments. We propose an Integer Linear Programming formulation to breakdown a path into a set of non-failing segments, leaving the remaining to be likely-failing ones. Our algorithm yields a very high “diagnosis resolution” in identifying failing segments, and in ranking them.
由于制造变化导致的失效速度路径段的后硅诊断
我们研究了由于制造变化而在硅后阶段不受时间约束的速度路径上的段的诊断。我们提出了一种正式的程序,该程序在隔离失败的速度路径后应用,该程序还结合了后硅路径延迟测量,以进行更准确的分析。我们的目标是确定失效的速度路径的片段,这些部分的后硅延迟大于预硅阶段的估计延迟。我们把这样的片段称为“失败片段”,并根据它们的失败程度对它们进行排序。故障段的诊断缓解了路径内部缺乏可观测性的问题。此外,通过关注故障部分,可以更有效地进行根本原因分析和硅后调优或修复。我们提出了一个整数线性规划公式,将路径分解为一组非故障段,留下剩余的可能失败的部分。我们的算法在识别故障片段和对它们进行排序方面产生了非常高的“诊断分辨率”。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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