M. Letz, T. Gotschke, F. Wagner, M. Heiss-Chouquet, L. Müller, U. Peuchert, D. Vanderpool
{"title":"Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.","authors":"M. Letz, T. Gotschke, F. Wagner, M. Heiss-Chouquet, L. Müller, U. Peuchert, D. Vanderpool","doi":"10.4071/1085-8024-2021.1.000098","DOIUrl":null,"url":null,"abstract":"\n Glasses can be used as core substrate for panel- and/or wafer-level packaging to achieve heterogeneous integration of chiplets and integrated passives in increasingly complex packages. Glass has a large number of advantages: The stiffness of glass (i) allows manufacturing of highly accurate buildup layers. These buildup layers can have manufacturing precision of 1μm and below on large dies with sizes of 50mm x 50mm and more, needed for antenna in package (AiP) applications and high performance computing (HPC). Special glasses can be made with adjusted thermal expansion (CTE) (ii), either adjusted to silicon or with larger thermal expansion to allow packages with buildup layers of epoxy molds and metallization that see high thermal loads either during manufacturing or during operation. Glasses can also be optimized with very good dielectric properties (iii) and can be utilized in antenna-in-package applications. But most of all, economic glass structuring techniques (iv) which can provide millions of vias and thousands of cut-outs in a glass panel are important and are being developed. SCHOTTs Structured Glass Portfolio FLEXINITY® and related technologies provide an excellent starting point for highly sophisticated structured glass substrates required for Advanced Packaging. The biggest hurdle for a large-scale commercialization of glass panel packaging is industrial readiness along the whole process chain. This is needed, to bring glass panel packaging in applications like IC-packaging, RF-MEMS packaging and medical diagnostics or, in combination with cutouts for fan-out, embedding of active and passive components. In addition, metallization processes with good adhesion, excellent electrical properties and high geometric accuracy for glasses are an important step. In the current manuscript, we review the status and discuss our contribution towards achieving industrial readiness for glass in panel- and wafer-level packaging.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"14 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000098","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Glasses can be used as core substrate for panel- and/or wafer-level packaging to achieve heterogeneous integration of chiplets and integrated passives in increasingly complex packages. Glass has a large number of advantages: The stiffness of glass (i) allows manufacturing of highly accurate buildup layers. These buildup layers can have manufacturing precision of 1μm and below on large dies with sizes of 50mm x 50mm and more, needed for antenna in package (AiP) applications and high performance computing (HPC). Special glasses can be made with adjusted thermal expansion (CTE) (ii), either adjusted to silicon or with larger thermal expansion to allow packages with buildup layers of epoxy molds and metallization that see high thermal loads either during manufacturing or during operation. Glasses can also be optimized with very good dielectric properties (iii) and can be utilized in antenna-in-package applications. But most of all, economic glass structuring techniques (iv) which can provide millions of vias and thousands of cut-outs in a glass panel are important and are being developed. SCHOTTs Structured Glass Portfolio FLEXINITY® and related technologies provide an excellent starting point for highly sophisticated structured glass substrates required for Advanced Packaging. The biggest hurdle for a large-scale commercialization of glass panel packaging is industrial readiness along the whole process chain. This is needed, to bring glass panel packaging in applications like IC-packaging, RF-MEMS packaging and medical diagnostics or, in combination with cutouts for fan-out, embedding of active and passive components. In addition, metallization processes with good adhesion, excellent electrical properties and high geometric accuracy for glasses are an important step. In the current manuscript, we review the status and discuss our contribution towards achieving industrial readiness for glass in panel- and wafer-level packaging.
玻璃可以用作面板和/或晶圆级封装的核心基板,以在日益复杂的封装中实现小芯片和集成无源的异构集成。玻璃有很多优点:玻璃的刚度(1)允许制造高度精确的堆积层。这些堆积层在尺寸为50mm x 50mm及以上的大型模具上的制造精度可达1μm及以下,适用于封装天线(AiP)应用和高性能计算(HPC)。特殊玻璃可以通过调整热膨胀(CTE) (ii)来制造,既可以调整为硅,也可以调整为更大的热膨胀,以允许在制造或操作过程中具有高热负荷的环氧模具和金属化层的封装。玻璃也可以优化为具有非常好的介电性能(iii),并可用于天线封装应用。但最重要的是,经济的玻璃结构技术(iv),它可以在玻璃面板上提供数百万个过孔和数千个切口,是重要的,并且正在开发中。肖特结构化玻璃组合flexity®和相关技术为先进封装所需的高度复杂的结构化玻璃基板提供了一个很好的起点。玻璃面板包装大规模商业化的最大障碍是整个工艺链上的工业准备。这是将玻璃面板封装应用于ic封装、RF-MEMS封装和医疗诊断等应用所必需的,或者与扇形输出的切割结合使用,嵌入有源和无源组件。此外,具有良好附着力、优异电性能和高几何精度的金属化工艺是玻璃的重要一步。在目前的手稿中,我们回顾了现状,并讨论了我们对实现面板和晶圆级封装玻璃的工业就绪度的贡献。