Sizing of back-surface flaws by piezoelectric highpolymer film

A. Yamamoto, S. Biwa, E. Matsumoto
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引用次数: 1

Abstract

Piezoelectric thin film has been used to visualize back surface flaws in plates. If the plate with a surface flaw is deformed, the strain distribution appears on the other surface reflecting the location and the shape of the flaw. Such surface strain distribution can be transformed into the electric potential distribution on the piezoelectric film mounted on the plate surface. The purpose of this paper is to estimate the size of a back-surface flaw from the electric potential distribution. The numerical simulation of this technique for various sizes of flaws implies that the depth and the width of the surface flaw are related together with the height and the width of the potential peak. From the experimental verification on acrylic specimens with surface flaws, it is observed that the flaw depth can be exactly estimated but the width can not be.
压电高聚物薄膜对背表面缺陷的施胶
压电薄膜已被用于观察板的背面缺陷。如果表面有缺陷的板材发生变形,则在另一个表面上出现应变分布,反映缺陷的位置和形状。这种表面应变分布可以转化为安装在板表面的压电薄膜上的电势分布。本文的目的是从电位分布估计背表面缺陷的大小。对不同尺寸缺陷的数值模拟表明,表面缺陷的深度和宽度与电位峰的高度和宽度有关。通过对表面有缺陷的亚克力试件进行实验验证,发现缺陷深度可以准确估计,但宽度不能准确估计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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