MO-CVD growth of InGaAs using Me3Ga, AsMe3, AsH3 and Me3In or Et3In and analyses of adducts formed during the growth process

C.H. Cheng , K.A. Jones , K.M. Motyl
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引用次数: 2

Abstract

High quality InGaAs films have been grown using the adduct Me3InAsMe3 to block the room temperature reaction between Me3In and AsH3 and by using a cover piece to prevent the preferential evaporation of phosphorus from the InP substrate during the warm up. Infrared spectroscopy shows that Me3Ga+AsMe3 and Me3Ga+AsH3 form stable adducts at room temperature, Me3In+AsMe3 probably form a stable adduct, while Et3In+AsMe3 probably do not form a stable Lewis acid/base adduct. Poorer quality films are grown with Et3In than with Me3In because the AsMe3 is unable to prevent by adduct formation the room temperature reaction between Et3In and AsH3. Pyrolysis studies show that the individual alkyls are stable to ∼ 400°C and mixtures are stable to ∼ 350°C. The problems associated with the lower vapor pressure of the adducts, adduct dissociation at room temperature and the growth temperature, and using an adduct as the starting material are discussed.

用Me3Ga、AsMe3、AsH3和Me3In或Et3In进行InGaAs的MO-CVD生长及生长过程中形成的加合物分析
利用加合物Me3In⋅AsMe3阻断Me3In与AsH3的室温反应,并利用盖片防止升温过程中磷从InP衬底优先蒸发,从而生长出高质量的InGaAs薄膜。红外光谱分析表明,Me3Ga+AsMe3和Me3Ga+AsH3在室温下形成稳定的加合物,Me3In+AsMe3可能形成稳定的加合物,而Et3In+AsMe3可能不形成稳定的Lewis酸碱加合物。由于AsMe3不能通过加合物的形成来阻止Et3In与AsH3之间的室温反应,因此Et3In比Me3In生长的薄膜质量更差。热解研究表明,单个烷基在~ 400°C稳定,混合物在~ 350°C稳定。讨论了加合物蒸气压较低、室温和生长温度下加合物解离以及用加合物作为起始原料等问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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