Thermal transfer influence of delamination in the die attach layer of chip-on-board LED package base on entropy generation analysis

Yuezhu Mo, D. Yang, M. Cai, Dongjing Liu, Y. Nie
{"title":"Thermal transfer influence of delamination in the die attach layer of chip-on-board LED package base on entropy generation analysis","authors":"Yuezhu Mo, D. Yang, M. Cai, Dongjing Liu, Y. Nie","doi":"10.1109/ICEPT.2016.7583216","DOIUrl":null,"url":null,"abstract":"From the perspective of the irreversible energy loss of the second law of thermodynamics, that is entropy generation, theoretical analysis on the influence of delamination appeared at the die attach (DA) layer on the chip junction temperature of high power LED-COB package is carried out. First, thermal simulation of chip-on-board LED package with different position of interface delamination is investigated. The results show that delamination occurs at the edge position is more harmful for blocking heat transfer in the overall LED package than that of the center position. Second, entropy generation of edge position and center position in die attach layer with non-delamination is calculated. In the same conditions, the entropy generation value of the edge position is larger than that of the center position, that is, compared to center position, the larger irreversible heat flux loss in the edge position of die attach in the heat conduction process is higher.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"13 1","pages":"646-651"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583216","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

From the perspective of the irreversible energy loss of the second law of thermodynamics, that is entropy generation, theoretical analysis on the influence of delamination appeared at the die attach (DA) layer on the chip junction temperature of high power LED-COB package is carried out. First, thermal simulation of chip-on-board LED package with different position of interface delamination is investigated. The results show that delamination occurs at the edge position is more harmful for blocking heat transfer in the overall LED package than that of the center position. Second, entropy generation of edge position and center position in die attach layer with non-delamination is calculated. In the same conditions, the entropy generation value of the edge position is larger than that of the center position, that is, compared to center position, the larger irreversible heat flux loss in the edge position of die attach in the heat conduction process is higher.
基于熵生分析的片上LED封装贴片层分层对热传递的影响
从热力学第二定律的不可逆能量损失即熵产的角度出发,对高功率LED-COB封装中贴片层(DA)出现的分层对芯片结温的影响进行了理论分析。首先,对不同接口分层位置的片上LED封装进行了热仿真研究。结果表明,边缘位置发生的分层对整个LED封装的传热阻碍比中心位置的分层更有害。其次,计算了无分层的模具附着层边缘位置和中心位置的熵生成;在相同条件下,边缘位置的熵产值大于中心位置的熵产值,即与中心位置相比,在热传导过程中,附片边缘位置较大的不可逆热流通量损失更高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信