Package-on-package for chip cooling with embedded fluidics

T. Chua, S. Babikian, Liang L. Wu, G. Li, M. Bachman
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引用次数: 2

Abstract

Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm2. Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a “package-on-package” construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.
封装对封装芯片冷却与嵌入流体
现代半导体芯片正在达到更高的功率密度,需要超过100 W/cm2的冷却能力。液体冷却被广泛认为是为这些设备提供冷却的合适技术,然而,方便的、集成的冷却技术是不可用的。我们报告了一种芯片冷却封装的使用,该封装设计用于直接与嵌入式流体系统接口,该系统可以在印刷电路板上传输冷却液体。该封装被设计为“封装上封装”结构,因此它可以封装在现有的电子芯片上,为各种组件提供基于流体的冷却。本文介绍了该封装的设计与结构、流体集成和流动/热性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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