Package-on-package for chip cooling with embedded fluidics

Abstract

Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm2. Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a “package-on-package” construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.